Wire Bond Packaging in the Global OSAT Market is expected to reach $17.1 Billion by 2028 – An exclusive market research report by Lucintel
Lucintel’s latest market report analyzed that wire bond packaging in the global OSAT provides attractive opportunities in automotive, telecommunication, computing & networking, consumer electronic, and industrial applications. The wire bond packaging in the global OSAT market is expected to reach $17.1 billion by 2028 with a CAGR of 6.5%. In this market, assembly & packaging is the largest segment by service type, whereas industrial is largest by application.
Based on service type, the wire bond packaging in the global OSAT market is segmented into assembly & packaging and testing. The assembly & packaging segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to the introduction latest chip packaging technologies such as TSV packaging and MEMs packaging.
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The Wire Bond Packaging in the Global OSAT Market is marked by the presence of several big and small players. Some of the prominent players offering wire bond packaging in the global OSAT include Amkor, Jiangsu Changjiang Electronics Technology, Siliconware Precision Industries, PTI (Powertech Technology Inc.), and ChipMOS.
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This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link [email protected].
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Roy AlmaguerLucintel Dallas, Texas, USA Email: [email protected] Tel. 972.636.5056
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